First Live Image of Sonim XP400 Revealed: A Rugged Smartphone with a Modern Twist
The first live image of Sonim’s upcoming XP400 has surfaced, offering a peek into what might be the company’s next rugged powerhouse. The image, shared on one of Sonim’s official social media platforms, shows the rear of the phone, which carries a hardened design similar to its predecessors, but with some subtle changes.
The back of the XP400 features a textured grid pattern that enhances both its toughness and grip; an important factor for anyone working in a rugged terrain. What stands out most, however, is the camera module.
Positioned in the middle of a raised camera island the dual-camera setup is flanked by Sonim branding on one side and what looks like a dual-tone LED flash on the other. The overall look seems to borrow inspiration from Google’s latest Pixel series, which gives the phone a more modern feel while retaining the rugged identity of Sonim.
Additionally, the phone appears to have reinforced edges, a feature aimed at improving its drop resistance, which is another crucial aspect for a device built to endure tough environments. This is an obvious shift from the archaic design of the previous XP10 5G, balancing durability with more contemporary aesthetics.
What to Expect From the XP400 5G
While we don’t have official confirmation on many of the XP400’s specs yet, a few key details are likely. The phone is expected to come with a 6.5-inch display, possibly covered by Corning Gorilla Glass Victus, the same screen protection used on the older XP10. Powering the device will be the Snapdragon 4 Gen 2 CPU from Qualcomm.
The dual-camera system mentioned above could feature a 50MP main sensor, though exact details on the secondary camera are still unclear. The phone is also said to come with a 5000mAh battery which is the exact capacity of the current XP10 5G.
As for other aspects like RAM, storage, and OS, there’s no official word yet. Sonim had said the XP400 will be available in stores towards the end of the year, so we hope to lay our hands on the full specification as we approach this timeline.
